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DAPENG
Picosecond laser glass cutting machine for glass cutting Sapphire glass cutting
Picosecond laser glass cutting machine catalogue en-US.pdf
Laser cutting machine not only plays a role in the field of cutting metal materials, but also has a wide range of applications in the field of non-metallic materials. Not only can cut hard and brittle materials, such as silicon nitride, ceramics, glass, quartz, etc.; but also cut and process flexible materials, such as fabric, paper, plastic plates, rubber, etc., such as clothing cutting with laser, can save 10% to 12% of clothing materials.
The current non-metal laser cutting application technology is picosecond cutting. Picosecond cutting can achieve cutting with peak light intensity obtained with lower pulse energy, while taking advantage of the low thermal energy diffusion to complete material interruption before heat transfer to the surrounding material, showing good results in brittle material cutting. The ultra-short pulses generated by the laser interact with the material for a very short time, when the laser pulse width reaches the picosecond or femtosecond magnitude, it can avoid the impact on the thermal movement of molecules and does not bring thermal impact to the surrounding material, so the laser processing is also called cold processing. Laser "cold processing" can reduce melting and heat-affected zone, less recasting of material, less micro-cracking of material, surface ablation quality, less dependence of laser absorption on material and wavelength, low thermal and cold ablation characteristics, and suitable for material processing.
At present, picosecond laser cutting is mainly used in the field of brittle material processing such as sapphire, optical glass, semiconductor packaging chip, ultra-thin super hard glass substrate, etc., which has improved the quality and efficiency of brittle material processing.
Picosecond glass cutting is currently widely used in the market, becoming the preferred processing direction for many glass product manufacturers, we focus on the process principle of cutting glass with picosecond laser cutting machine below.
Picosecond laser cutting machine to achieve the principle of glass cutting is picosecond ultra-fast laser radiation photons, the material for multi-photon absorption to generate conduction band electrons, electrons in the material movement emitted phonons, and the absorbed energy transferred to the lattice, the lattice to experience energy deposition caused by the melting of the material or mechanical damage to achieve the quality of microprocessing.
Laser cutting machine picosecond cutting glass is an easy to control non-contact less pollution technology to achieve cutting while bringing great green convenience to customers, while the advantages of neat edges, good perpendicularity and low internal damage can be guaranteed under the speed cutting, is becoming a new solution for the glass cutting industry is very popular in the market.
Picosecond cutting process performance index example
1、Glass cutting
Glass material: borosilicate glass, soda lime glass, etc., cutting thickness 0.5-20mm, cutting speed 50-1500mm/s, chipping <10um, thermal impact ≦10mm, R-angle cutting ≦100um, cutting edge without edge grinding.
2、Sapphire cutting
Material: sapphire, cutting thickness 0.5mm, cutting speed, 70mm / s; chipping edge 10um.
3、Ceramic cutting
Material: ceramic (H2SiO3 or Al2O3), no carbonization-"native color removal", no thermal fusion-clear edges and no residue. At present in China's consumer market, picosecond laser cutting machine as a new equipment in the field of micro processing, a wide range of use, for picosecond laser cutting machine provides a good market environment, is a cross-era "knife". With the continuous development of laser technology, laser picosecond laser cutting machine has been supported by hard technology, and subsequently extended to the manufacturing market.
Picosecond laser glass cutting machine for glass cutting Sapphire glass cutting
Picosecond laser glass cutting machine catalogue en-US.pdf
Laser cutting machine not only plays a role in the field of cutting metal materials, but also has a wide range of applications in the field of non-metallic materials. Not only can cut hard and brittle materials, such as silicon nitride, ceramics, glass, quartz, etc.; but also cut and process flexible materials, such as fabric, paper, plastic plates, rubber, etc., such as clothing cutting with laser, can save 10% to 12% of clothing materials.
The current non-metal laser cutting application technology is picosecond cutting. Picosecond cutting can achieve cutting with peak light intensity obtained with lower pulse energy, while taking advantage of the low thermal energy diffusion to complete material interruption before heat transfer to the surrounding material, showing good results in brittle material cutting. The ultra-short pulses generated by the laser interact with the material for a very short time, when the laser pulse width reaches the picosecond or femtosecond magnitude, it can avoid the impact on the thermal movement of molecules and does not bring thermal impact to the surrounding material, so the laser processing is also called cold processing. Laser "cold processing" can reduce melting and heat-affected zone, less recasting of material, less micro-cracking of material, surface ablation quality, less dependence of laser absorption on material and wavelength, low thermal and cold ablation characteristics, and suitable for material processing.
At present, picosecond laser cutting is mainly used in the field of brittle material processing such as sapphire, optical glass, semiconductor packaging chip, ultra-thin super hard glass substrate, etc., which has improved the quality and efficiency of brittle material processing.
Picosecond glass cutting is currently widely used in the market, becoming the preferred processing direction for many glass product manufacturers, we focus on the process principle of cutting glass with picosecond laser cutting machine below.
Picosecond laser cutting machine to achieve the principle of glass cutting is picosecond ultra-fast laser radiation photons, the material for multi-photon absorption to generate conduction band electrons, electrons in the material movement emitted phonons, and the absorbed energy transferred to the lattice, the lattice to experience energy deposition caused by the melting of the material or mechanical damage to achieve the quality of microprocessing.
Laser cutting machine picosecond cutting glass is an easy to control non-contact less pollution technology to achieve cutting while bringing great green convenience to customers, while the advantages of neat edges, good perpendicularity and low internal damage can be guaranteed under the speed cutting, is becoming a new solution for the glass cutting industry is very popular in the market.
Picosecond cutting process performance index example
1、Glass cutting
Glass material: borosilicate glass, soda lime glass, etc., cutting thickness 0.5-20mm, cutting speed 50-1500mm/s, chipping <10um, thermal impact ≦10mm, R-angle cutting ≦100um, cutting edge without edge grinding.
2、Sapphire cutting
Material: sapphire, cutting thickness 0.5mm, cutting speed, 70mm / s; chipping edge 10um.
3、Ceramic cutting
Material: ceramic (H2SiO3 or Al2O3), no carbonization-"native color removal", no thermal fusion-clear edges and no residue. At present in China's consumer market, picosecond laser cutting machine as a new equipment in the field of micro processing, a wide range of use, for picosecond laser cutting machine provides a good market environment, is a cross-era "knife". With the continuous development of laser technology, laser picosecond laser cutting machine has been supported by hard technology, and subsequently extended to the manufacturing market.
