Application of UV laser marking machine in PCB chip

Application of UV laser marking machine in PCB chip

Ultraviolet laser marking machine is the best choice for various PCB material applications in many industrial fields, from the production of the most basic circuit boards, circuit wiring, to the production of pocket embedded chips and other advanced processes. This material difference makes the UV laser marking machine the best choice for various PCB material applications in many industrial fields, from the production of the most basic circuit boards, circuit wiring, to the production of pocket embedded chips and other advanced processes. Universal.

The UV laser marking machine works quickly when producing circuits, and the surface pattern can be etched on the circuit board in a few minutes. This makes UV lasers the fastest way to produce PCB samples. More and more sample laboratories are equipped with internal UV laser systems.

Depending on the verification of optical instruments, the size of the ultraviolet laser beam can reach 10-20 μm to produce flexible circuit traces. Ultraviolet rays have the greatest advantage in the production of circuit traces. The circuit traces are extremely small and can only be seen under a microscope.

UV laser marking machine cutting is the best choice for large or small production, and it is also a good choice for PCB disassembly, especially when it needs to be applied to flexible or rigid-flex circuit boards. Disassembly is the removal of a single circuit board from the panel. Considering the continuous increase in material flexibility, this disassembly will face great challenges.

Mechanical disassembly methods such as V-groove cutting and automatic circuit board cutting are prone to damage sensitive and thin substrates, which cause problems for electronics manufacturing service (EMS) companies when disassembling flexible and rigid-flex circuit boards.

Ultraviolet laser marking machine cutting can not only eliminate the influence of mechanical stress generated during the disassembly process such as cutting edge processing, deformation and damage to circuit components, but also have less thermal stress impact than other lasers such as CO2 laser cutting.

The reduction of "cutting buffer" can save space, which means that components can be placed closer to the edge of the circuit, and more circuits can be installed on each circuit board, which maximizes efficiency and reaches the maximum limit of flexible circuit applications .