Laser welding is used in the electronics field

Principle: Laser welding is a welding process that uses laser action to produce instantaneous melting on the metal surface to connect the metal.

Features: Due to the continuous development of miniaturization of components, small solder joints, high soldering strength, and small heat-affected zone around the processing point are required. Therefore, the traditional welding process is difficult to meet the requirements, and laser welding can be achieved. The laser can produce true welding, melting and mixing the materials in all aspects of the contact.

The main features of laser welding:

1, fast welding speed, large aspect ratio, small deformation

  2. High air tightness, simple equipment

3. Suitable for working under various conditions

4. It can weld dissimilar and high melting point metals

5. Simultaneous processing and multi-station processing are possible

6. Can implement non-contact long-distance optical fiber transmission welding

Scope of application: In the assembly operation of microelectronics technology, it is widely used in micro-circuit components, such as the connection of lead wires and printed circuit boards, the connection of lead wires and silicon contacts, the soldering of thin wires and films, integrated circuits, and coplanarity. The connection between the leads and the printed circuit board. It can also be applied to kinescope electron guns, relays, sensors, optical isolators, fiber couplers, FC/SC detectors, lasers, coaxial devices, light receiving modules, light reflection modules, various batteries...