DP GROUP, founded in 2016, offer professional laser solutions and sheet metal fabrication machinery. Headquartered in Hong Kong, we operate three factories in mainland China:
DPMach (Dongguan): Specializes in laser cutting, welding, and marking.
DGDY (Dongguan): Focuses on press brake machines with advanced Panel Bender technology.
DPQG (Foshan): Manufactures large tube laser cutting machines for pipes up to 800mm in diameter and 30 meters lenth.
DP GROUP, founded in 2016, offer professional laser solutions and sheet metal fabrication machinery. Headquartered in Hong Kong, we operate three factories in mainland China:
DPMach (Dongguan): Specializes in laser cutting, welding, and marking.
DGDY (Dongguan): Focuses on press brake machines with advanced Panel Bender technology.
DPQG (Foshan): Manufactures large tube laser cutting machines for pipes up to 800mm in diameter and 30 meters lenth.
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Shadow Masks
Precision laser cutting machines are advanced manufacturing tools designed to produce shadow masks and deposition masks with extremely fine and accurate micro-hole patterns. These masks are critical components in thin-film deposition processes used extensively in electronics, semiconductor manufacturing, OLED display fabrication, and optical device production.
Using state-of-the-art laser technology, these machines provide unparalleled precision, repeatability, and flexibility for producing high-quality masks that meet the demanding specifications of modern microfabrication.
Micron-Level Accuracy:
Precision laser cutting machines can create holes and apertures down to a few microns in diameter with exceptional dimensional accuracy, essential for intricate pattern definition in thin-film deposition.
Complex Pattern Capability:
The systems support highly complex, dense, and customizable hole patterns, allowing mask designs tailored to unique device architectures and deposition requirements.
High-Quality Edge Finish:
Laser cutting produces smooth, burr-free edges with minimal heat-affected zones, preserving mask integrity and ensuring consistent deposition performance.
Material Versatility:
These machines are capable of processing a wide range of materials including stainless steel, nickel alloys, copper alloys, and specialized corrosion-resistant metals typically used for shadow masks.
Automation and Efficiency:
Integrated automation options such as CNC control, automated loading/unloading, and real-time process monitoring maximize throughput while maintaining consistent quality.
Flexible Software Control:
Advanced CAD/CAM software integration enables precise control over cutting parameters, pattern designs, and nesting strategies to optimize material use and reduce waste.
Electronics and Semiconductor Manufacturing:
Production of shadow masks for microelectronic thin-film deposition, critical in IC fabrication, chip packaging, and MEMS devices.
OLED and Display Panel Fabrication:
Manufacturing masks for organic material deposition in OLED screens, ensuring pixel-level accuracy and uniformity.
Optical Components and Sensors:
Fabrication of masks used for coating optical filters, sensors, and photonic devices with precise patterning requirements.
Thin-Film Coating and Surface Treatment:
Utilized in high-precision deposition for coatings that require strict pattern control such as protective films, anti-reflective layers, and decorative finishes.
Non-Contact Processing:
Laser cutting is a non-contact process, eliminating mechanical stresses or deformations on thin, delicate metal masks.
Repeatable High Throughput:
Capable of continuous production with minimal downtime, enabling large-scale manufacturing without compromising precision.
Minimal Thermal Distortion:
Optimized laser parameters reduce heat input, maintaining dimensional stability and extending mask lifespan.
Real-Time Quality Control:
Integrated vision systems and sensors provide real-time feedback and error detection, ensuring consistent mask quality.
Precision laser cutting machines represent a vital technology in the fabrication of shadow masks and deposition masks, enabling microfabrication at scales and accuracies unattainable by traditional methods. Their combination of precision, speed, and flexibility supports innovation in electronics, semiconductors, display technologies, and optical devices, driving forward the capabilities of thin-film deposition processes worldwide.
For companies demanding the highest quality and precision in mask manufacturing, precision laser cutting machines offer an indispensable solution.
Precision laser cutting machines are advanced manufacturing tools designed to produce shadow masks and deposition masks with extremely fine and accurate micro-hole patterns. These masks are critical components in thin-film deposition processes used extensively in electronics, semiconductor manufacturing, OLED display fabrication, and optical device production.
Using state-of-the-art laser technology, these machines provide unparalleled precision, repeatability, and flexibility for producing high-quality masks that meet the demanding specifications of modern microfabrication.
Micron-Level Accuracy:
Precision laser cutting machines can create holes and apertures down to a few microns in diameter with exceptional dimensional accuracy, essential for intricate pattern definition in thin-film deposition.
Complex Pattern Capability:
The systems support highly complex, dense, and customizable hole patterns, allowing mask designs tailored to unique device architectures and deposition requirements.
High-Quality Edge Finish:
Laser cutting produces smooth, burr-free edges with minimal heat-affected zones, preserving mask integrity and ensuring consistent deposition performance.
Material Versatility:
These machines are capable of processing a wide range of materials including stainless steel, nickel alloys, copper alloys, and specialized corrosion-resistant metals typically used for shadow masks.
Automation and Efficiency:
Integrated automation options such as CNC control, automated loading/unloading, and real-time process monitoring maximize throughput while maintaining consistent quality.
Flexible Software Control:
Advanced CAD/CAM software integration enables precise control over cutting parameters, pattern designs, and nesting strategies to optimize material use and reduce waste.
Electronics and Semiconductor Manufacturing:
Production of shadow masks for microelectronic thin-film deposition, critical in IC fabrication, chip packaging, and MEMS devices.
OLED and Display Panel Fabrication:
Manufacturing masks for organic material deposition in OLED screens, ensuring pixel-level accuracy and uniformity.
Optical Components and Sensors:
Fabrication of masks used for coating optical filters, sensors, and photonic devices with precise patterning requirements.
Thin-Film Coating and Surface Treatment:
Utilized in high-precision deposition for coatings that require strict pattern control such as protective films, anti-reflective layers, and decorative finishes.
Non-Contact Processing:
Laser cutting is a non-contact process, eliminating mechanical stresses or deformations on thin, delicate metal masks.
Repeatable High Throughput:
Capable of continuous production with minimal downtime, enabling large-scale manufacturing without compromising precision.
Minimal Thermal Distortion:
Optimized laser parameters reduce heat input, maintaining dimensional stability and extending mask lifespan.
Real-Time Quality Control:
Integrated vision systems and sensors provide real-time feedback and error detection, ensuring consistent mask quality.
Precision laser cutting machines represent a vital technology in the fabrication of shadow masks and deposition masks, enabling microfabrication at scales and accuracies unattainable by traditional methods. Their combination of precision, speed, and flexibility supports innovation in electronics, semiconductors, display technologies, and optical devices, driving forward the capabilities of thin-film deposition processes worldwide.
For companies demanding the highest quality and precision in mask manufacturing, precision laser cutting machines offer an indispensable solution.
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