DP GROUP, founded in 2016, offer professional laser solutions and sheet metal fabrication machinery. Headquartered in Hong Kong, we operate three factories in mainland China:
DPMach (Dongguan): Specializes in laser cutting, welding, and marking.
DGDY (Dongguan): Focuses on press brake machines with advanced Panel Bender technology.
DPQG (Foshan): Manufactures large tube laser cutting machines for pipes up to 800mm in diameter and 30 meters lenth.
DP GROUP, founded in 2016, offer professional laser solutions and sheet metal fabrication machinery. Headquartered in Hong Kong, we operate three factories in mainland China:
DPMach (Dongguan): Specializes in laser cutting, welding, and marking.
DGDY (Dongguan): Focuses on press brake machines with advanced Panel Bender technology.
DPQG (Foshan): Manufactures large tube laser cutting machines for pipes up to 800mm in diameter and 30 meters lenth.
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DAPENG
DAPENG 2500*1300MM New Design Large Format UV laser marking machine
Gantry type 2513 large format UV laser marking machine
Ultraviolet laser marking machine belongs to a series of products of laser marking machine, but it is developed with 355nm ultraviolet laser. Compared with infrared laser, the machine adopts third-order intracavity frequency doubling technology. To a large extent, the mechanical deformation of the material is reduced and the thermal influence of processing is small, because it is mainly used for ultra-fine marking and engraving, especially suitable for food, medical packaging material marking, micro-hole drilling, high-speed division of glass materials and silicon wafers for complex pattern cutting and other applications.
DAPENG 2500*1300MM New Design Large Format UV laser marking machine
Gantry type 2513 large format UV laser marking machine
Ultraviolet laser marking machine belongs to a series of products of laser marking machine, but it is developed with 355nm ultraviolet laser. Compared with infrared laser, the machine adopts third-order intracavity frequency doubling technology. To a large extent, the mechanical deformation of the material is reduced and the thermal influence of processing is small, because it is mainly used for ultra-fine marking and engraving, especially suitable for food, medical packaging material marking, micro-hole drilling, high-speed division of glass materials and silicon wafers for complex pattern cutting and other applications.
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