Laser Cutting And Splitting Integrated Machine for Optical Glass Camera Lenses And Ceramics

Laser Cutting and Splitting Integrated Machine for Glass

This Laser Cutting and Splitting Integrated Machine is designed to perform precision cutting and perforation of various materials used in the electronics industry, including sapphire glass windows, smartphone covers, optical glass, and other brittle materials. It combines high-speed, high-precision cutting with an automated system for efficient product processing. The machine features modular design, offering flexibility and ease of expansion.

Key Features:

1. High Precision and Speed:

• The system uses linear motors with a dual-platform structure, providing high precision, speed, and stability for both cutting and splitting operations.

• Cutting Head: High-speed cutting with excellent cutting effects.

2. CCD Positioning System:

• The CCD system ensures accurate positioning, reducing the need for complex clamping setups and increasing automation efficiency.

3. User-Friendly Design:

• The machine is designed for easy operation, providing a user-friendly interface for simple and efficient control.

4. Modular Design:

• The system’s modular design allows for easy expansion of functions, providing flexibility for future upgrades.

5. Material Compatibility:

• Ideal for transparent, brittle materials such as sapphire glass (used in camera windows and smartphone covers), optical glass, and other materials used in the electronics industry.

Operating Principle:

1. Product Loading and Positioning:

• The operator places the product onto the Fixture 1, which then moves to the cutting position.

2. Cutting Process:

• The CCD system accurately locates the product, and cutting is performed.

• After cutting, the product moves to the rear area for splitting.

3. Post-Processing:

• Once the cutting and splitting process is complete, the operator manually removes the processed product.

4. Fixture 2:

• The operation of Fixture 2 is similar to that of Fixture 1, ensuring continuous processing without interruptions.

Platform and Motion System:

1. Marble Platform:

• Provides stable support, corrosion resistance, and ensures high precision.

2. Linear Motors (X/Y Axes):

• Uses linear motors with optical scales and a dual-position platform for fast, precise movement.

• The motion control system utilizes closed-loop control, ensuring high precision without physical contact between the stator and rotor, resulting in no wear over time.

3. Movement Specifications:

• Flatness of Marble Platform: ±0.01mm

• Platform Type: Dual-position platform

• X/Y Axes Stroke: 1620 x 1410 mm

• Maximum Speed: ≤1000mm/s

• Acceleration: ≥10000mm/s²

• Positioning Accuracy: ≤ ±3μm

• Repeat Positioning Accuracy: ≤ ±3μm

Laser Cutting Module:

1. Pico-second Laser:

• The pico-second laser offers high peak power, with minimal thermal impact, making it ideal for processing brittle materials like sapphire glass and optical glass.

2. Optical Path Module:

• The optical system uses high-quality imported lenses from Germany and Japan, ensuring precision and high-performance light paths for critical cutting operations.

3. Z-Axis Module (Cutting Head, Vision System, Servo Motor):

• Cutting Head: Ensures no tapering, minimal debris, and edge collapse, with high strength.

• Vision System: Equipped with a CCD camera, lenses, and coaxial light source for precise alignment and high accuracy.

Laser Splitting Module:

1. CO2 Laser:

• The CO2 laser is used for the splitting process, offering high peak power and minimal thermal impact, perfect for cutting brittle materials.

2. Optical Path Module:

• Similar to the cutting module, it uses high-quality optical components from Germany and Japan, ensuring accurate light paths.

3. Z-Axis Module (Splitting Head, Vision System, Servo Motor):

• Splitting Head: Ensures no residue, minimal edge collapse, and high strength.

• Vision System: Equipped with a CCD camera, lenses, and coaxial light source for precise positioning.

Laser Cutting and Splitting Integrated Machine

This Laser Cutting and Splitting Integrated Machine combines pico-second laser cutting, CO2 laser splitting, and an automatic loading/unloading system to handle the precision cutting and separation of transparent and brittle materials. The machine utilizes a pico-second laser for focused beam cutting, while the CO2 laser heats the cut lines to separate the product from waste material through thermal expansion and contraction.

Key Features:

• High Precision:

• Minimal edge collapse and no tapering.

• Small thermal impact, with very few debris and dust.

• High-quality processing results.

• Pico-second Laser Beam Quality:

• The pico-second laser provides excellent beam quality with small focal spots and high power stability.

• Advanced Linear Motors:

• The machine uses imported high-speed, high-precision linear motors for faster and more accurate movements.

• Automatic Loading/Unloading:

• The system supports automatic loading and unloading, improving the overall efficiency and reducing manual handling.

Applications:

• Cutting Transparent and Brittle Materials:

• Ideal for processing delicate materials such as camera rear lenses, code disks, and other transparent brittle materials.

Sample Display:

• Sample parts processed by this machine typically include high-precision glass and ceramic components, such as those used in optical lenses, electronic components, or automotive parts.

Machine Specifications:

Advantages:

• Precision Cutting: With minimal thermal influence, the laser ensures clean edges and accurate cuts, even on delicate materials.

• Fast and Efficient: The high-speed, high-precision linear motors, along with the automatic loading and unloading system, allow for rapid production and reduced downtime.

• Long Machine Life: The laser has a long operational lifetime of over 20,000 hours, offering durability and reliability for continuous production.

• Versatility: The machine can process different types of glass and brittle materials, making it versatile for use in various industries.

Applications in Various Industries:

1. Electronics:

• Cutting optical glass, lens covers, and camera lenses used in smartphones, cameras, and displays.

2. Automotive:

• Precision cutting of glass or ceramics for automotive windows and headlights.

3. Medical Devices:

• Producing high-precision components for medical equipment that require clean, non-damaging cuts.

4. Optical Industry:

• Cutting and splitting of optical fibers and precision lenses for use in cameras, telescopes, and other optical devices.